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EMMC EMCP UFS 식재 주석 플랫폼 스텐실 풀 세트, BGA 153 162 169 186 221 254 칩, 범용 BGA 리볼링 스텐실 주석 네트
Full Set EMMC EMCP UFS Planting Tin Platform Stencils BGA 153 162 169 186 221 254 Chip Universal BGA Reballing Stencil Tin Net
Description：
This is laser custom BGA Stencil.Produce all the steel mesh you need.The quality is the most accurate.The products come in three different sizes.1. Direct heating -- Same chip size2. 80MM*80MM3. 90MM*90MMWe can customize the size of the product according to your requirements, or the size of the tin ball.If you need any other products, please contact me.
Material : Made of imported stainless steel plate
Model Number : EMMC EMCP UFS BGA 153 162 169 186 221 254 Planting Tin Platform
Name : EMMC EMCP UFS BGA 153 162 169 186 221 254 Planting Tin Platform
Specifications : BGA Tin Kit And Stencils
Pieces Included : 1
Fineness : customize new stencils
With Magnetic : No
Origin : Mainland China
Material : Other
stencils model : EMMC EMCP UFS BGA 153 162 169 186 221 254
