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Amaoe MI6 BGA Reballing 스텐실 템플릿, Redmi Note 5 5Pro Xiaomi Note3 6X CPU SDM660 SDM636 RAM POWER WIFI 오디오 IC 칩

USD 4.68USD 5.20

Amaoe MI6 BGA Reballing 스텐실 템플릿, Redmi Note 5 5Pro Xiaomi Note3 6X CPU SDM660 SDM636 RAM POWER WIFI 오디오 IC 칩

Description
Specification
XL3001 STM32F030F4P6...TC164-JR
USD 522.00USD 725.00
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