Name: Mechanic BGA Reballing 스텐실 kirfor iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865 - Yiwiqi - 021252 - ko.qupqukj.id
SKU: 1005005393021252
Price: 9.30 USD
Availability: InStock

Mechanic BGA Reballing 스텐실 kirfor iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865

범주 : 도구 | 도구 부품

USD 9.30

Mechanic BGA Reballing 스텐실 kirfor iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865

Description
Specification

Mechanic BGA Reballing 스텐실 kirfor iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865

Description

Specification

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