product description: Thermal paste (white paste); Thermal conductivity>0.671W/m.k; Breaking strength 1.5MPA; Surface vulcanization time 10MIN/25°C

Scope of application: High strength, Fast bonding effect, Suitable for all kinds of components, LEDs and heat sinks that need to be directly bonded firmly, etc.)

Packing specification: 5 g / stick, The package is airtight and the jacket vacuum bag isolates the air and increases the storage time.

Product performance: It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C. In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free, and can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.

Instructions: 1. When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again; 2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa; 3, the recommended thickness of the application: 0.1-0.5mm, the thinner the better. 4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.